Ashwinkumar C. Bhatt
29Patents
13h-index
45Co-inventors
81Inventor score
Filing activity: Oct 22, 1991 → Apr 8, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6608757B1 | Method for making a printed wiring board | Electricity | 111 | Expired |
| US5268260A | Photoresist develop and strip solvent compositions and method for their use | Physics | 80 | Expired |
| US5798909A | Single-tiered organic chip carriers for wire bond-type chips | Emerging Cross-Sectional Technologies | 54 | Expired |
| US6162365A | Pd etch mask for copper circuitization | Emerging Cross-Sectional Technologies | 51 | Expired |
| US5578796A | Apparatus for laminating and circuitizing substrates having openings therein | Emerging Cross-Sectional Technologies | 44 | Expired |
| US5724232A | Chip carrier having an organic photopatternable material and a metal substrate | Emerging Cross-Sectional Technologies | 34 | Expired |
| US6009620A | Method of making a printed circuit board having filled holes | Emerging Cross-Sectional Technologies | 29 | Expired |
| US5599747A | Method of making circuitized substrate | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5566448A | Method of construction for multi-tiered cavities used in laminate carriers | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6426565B1 | Electronic package and method of making same | Electricity | 16 | Expired |
| US6127097A | Photoresist develop and strip solvent compositions and method for their use | Physics | 15 | Expired |
| US5817405A | Circuitized substrate with same surface conductors of different resolutions | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6038137A | Chip carrier having a chip mounted on an organic dielectric substrate overlaid with a photoimageable dielectric having circuitry thereon | Emerging Cross-Sectional Technologies | 13 | Expired |
| US7261466B2 | Imaging inspection apparatus with directional cooling | Physics | 13 | Expired |
| US5707893A | Method of making a circuitized substrate using two different metallization processes | Emerging Cross-Sectional Technologies | 12 | Expired |
| US7596863B2 | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein | Emerging Cross-Sectional Technologies | 12 | Active |
| US5542175A | Method of laminating and circuitizing substrates having openings therein | Emerging Cross-Sectional Technologies | 12 | Expired |
| US7354197B2 | Imaging inspection apparatus with improved cooling | Electricity | 9 | Expired |
| US7510324B2 | Method of inspecting articles using imaging inspection apparatus with directional cooling | Physics | 9 | Active |
| US7490984B2 | Method of making an imaging inspection apparatus with improved cooling | Electricity | 8 | Active |
| US5922517A | Method of preparing a substrate surface for conformal plating | Physics | 6 | Expired |
| US5827386A | Method for forming a multi-layered circuitized substrate member | Electricity | 5 | Expired |
| US6093335A | Method of surface finishes for eliminating surface irregularities and defects | Electricity | 3 | Expired |
| US7801833B2 | Item identification control method | Physics | 3 | Active |
| US6274291A | Method of reducing defects in I/C card and resulting card | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.