Semi-conductor personalization structure and method
US6093630A · kind A · utility
19Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 1998 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | May 18, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The preferred embodiment of the present invention provides a structure and method for personalizing a semiconductor device in the context of a bump array connection to packaging, substrates and such. The preferred embodiment method uses a plurality of conduction lines on said semiconductor device, including a plurality of landing lines and personalization lines. Vias are opened to the plurality of landing lines and selectively opened to a portion of the personalization lines. Connections are made between the opened personalization lines with bumps deposited as part of the bump array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.