Patent · US Expired

Manufacturing method for a thin film with an anti-reflection rough surface

US6093646A · kind A · utility

1Cited by
3References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 2, 1998
Grant dateJul 25, 2000
Priority date
Expiry dateMar 2, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/32139
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present invention provides a manufacturing method for a poly film with an anti-reflection rough surface is provided. The method comprises steps of, at first, a thin film is formed over a substrate, and a amorphous silicon layer is formed over the thin film. Next, in situ a first annealing procedure is performed over the amorphous silicon layer. The amorphous silicon layer is changed into a polysilicon layer with the anti-reflection rough surface. Next, in situ a second annealing procedure is selectively performed. The polysilicon layer with the anti-reflection rough surface is doped by reacting with a gas induced. Then, the thin film and the polysilicon layer with the anti-reflection rough surface is defined, whereby the poly film with an anti-reflection rough surface is formed over the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.