Polishing slurry compositions capable of providing multi-modal particle packing and methods relating thereto
US6093649A · kind A · utility
25Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 1998 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | Aug 7, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Water based polishing slurries, comprising oxide polishing particles. The polishing slurries comprise an innovative (multi-modal) particle distribution for improved polishing performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.