Lead frame having supporters and semiconductor package using same
US6093959A · kind A · utility
3Cited by
3References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 1997 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | Jan 17, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame and a semiconductor chip package includes supporters on a lead frame paddle and tiebars using the same for preventing undesired paddle bending which may occur due to the pressure of an epoxy molding compound during the molding process. The supports also allow improved heat dissipation during the molding process of the semiconductor chip package and mounting process of the package onto a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.