Face-to-face (FTF) stacked assembly of substrate-on-bare-chip (SOBC) modules
US6093969A · kind A · utility
Inventor
Key dates
| Filing date | May 15, 1999 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | May 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a face-to-face (FTF) stacked integrated circuit (IC) assembly. The FTF stacked IC assembly includes a first and a second substrate-on-bare-chip (SOBC) modules. Each of the first and second SOBC modules includes a printed circuit board (PCB) having a PCB bottom surface overlying an active circuit surface of a bare integrated circuit (IC) chip. The PCB includes a window opened substantially in a central portion of the active circuit surface of the bare IC chip. The bare IC chip includes bare-chip bonding-pads disposed on the active circuit surface in the window and the PCB includes a plurality of PCB bonding pads. Each of the first and second SOBC modules includes a plurality of bonding wires interconnecting the bare-chip bonding pads to the PCB bonding pads. Each of the first and second SOBC modules includes a plurality of solder balls disposed on a PCB top surface of the PCB connected to the PCB bonding pads with a plurality of metal traces disposed on the PCB board. The solder balls of first SOBC module mounted on the solder balls of the second SOBC module constituting a face-to-face (FTF) stacked SOBC assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.