Semiconductor device and method for manufacturing the same
US6093970A · kind A · utility
36Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1999 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | Jul 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved semiconductor device and method of manufacturing employs interconnecting films on film circuit as ground lines which extend to the periphery of the film circuit where there is a further connection to a conductive reinforcing plate 25. Advantageously, the conductive reinforcing plate reduces electrical noise from interfering with the semiconductor device and prevents the semiconductor device from radiating undesired signals. The interconnecting films also reduce cross-talk between signal lines of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.