Orbital motion chemical-mechanical polishing method and apparatus
US6095904A · kind A · utility
12Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 1996 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Feb 1, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is fed through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.