Patent · US Expired

Method for introduction of an impurity dopant in SiC, a semiconductor device formed by the method and a use of a highly doped amorphous layer as a source for dopant diffusion into SiC

US6096627A · kind A · utility

12Cited by
12References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 15, 1998
Grant dateAug 1, 2000
Priority date
Expiry dateJul 15, 2018

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S438/931
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method for introducing an impurity dopant into a semiconductor layer of SiC is provided. Ions are implanted into the semiconductor layer so that a near surface of the semiconductor layer becomes doped and amorphous. The semiconductor layer is then annealed at a temperature so that the dopant diffuses into a non-implanted sublayer of the semiconductor layer below the near surface layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.