Snap cure adhesive based on anhydride/epoxy resins
US6096808A · kind A · utility
0Cited by
4References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 29, 1998 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Jan 29, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A two-stage accelerator for use in filled anhydride/epoxy systems is disclosed. In particular, the present invention makes use of a first accelerator to initiate curing of the epoxy while the filler becomes wetted, and a second, faster accelerator to complete the curing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.