Multi-chip land grid array carrier
US6097611A · kind A · utility
16Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1999 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Sep 17, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A land grid array (LGA) carrier includes an interposer having a first surface and a second surface opposite the first surface, with a plurality of locations on the first surface adapted to receive a plurality of semiconductor dice and passive components. The second surface has a plurality of conductive pads coupled thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.