Method of manufacturing a semiconductor device and an apparatus for manufacturing the same
US6098638A · kind A · utility
9Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 1996 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Dec 26, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
In a CMP process for flatting a surface of a film on a semiconductor wafer, ionized water is used as rinsing liquid in the post-polishing step performed after the main CMP polishing step. With ionized water as rinsing liquid, abrasive particles adhered to the film surface during the main polishing step are removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.