Jun Takayasu
16Patents
6h-index
17Co-inventors
63Inventor score
Filing activity: Nov 28, 1995 → Feb 2, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6007696A | Apparatus and method for manufacturing electrolytic ionic water and washing method using electroyltic ionic water | Chemistry; Metallurgy | 25 | Expired |
| US6354913B1 | Abrasive and method for polishing semiconductor substrate | Electricity | 19 | Expired |
| US6723226B1 | Method and apparatus for forming electrolytic water and apparatus for washing semiconductor substrate using electrolytic water-forming apparatus | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6098638A | Method of manufacturing a semiconductor device and an apparatus for manufacturing the same | Chemistry; Metallurgy | 9 | Expired |
| US6001238A | Method for purifying pure water and an apparatus for the same | Emerging Cross-Sectional Technologies | 8 | Expired |
| US5665464A | Carbon fiber-reinforced carbon composite material and process for the preparation thereof | Emerging Cross-Sectional Technologies | 8 | Expired |
| US9539696B2 | Retainer ring, polish apparatus, and polish method | Performing Operations; Transporting | 5 | Active |
| US9902038B2 | Polishing apparatus, polishing method, and semiconductor manufacturing method | Performing Operations; Transporting | 3 | Active |
| US7037839B2 | Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry | Electricity | 2 | Expired |
| US8823079B2 | Semiconductor device and method for manufacturing same | Electricity | 1 | Active |
| US10249518B2 | Polishing device and polishing method | Electricity | 1 | Active |
| US9502318B2 | Polish apparatus, polish method, and method of manufacturing semiconductor device | Electricity | 1 | Active |
| US10441979B2 | Cleaning apparatus and cleaning method | Human Necessities | 0 | Active |
| US9296083B2 | Polishing apparatus and polishing method | Electricity | 0 | Active |
| US6878631B2 | Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive | Chemistry; Metallurgy | 0 | Expired |
| US9947555B2 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.