Polishing pad for semiconductor wafer and method for polishing semiconductor wafer
US6099390A · kind A · utility
11Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 1999 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Apr 5, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad used for polishing a film on a semiconductor wafer and made of a plastic includes a polishing pad body, and a large number of convex portions, which are provided on the surface of the polishing pad body just like so many islands and each have a flat top surface. An average length L of respective sides or diameters of the convex portions on the top surface thereof is in the range from 0.1 mm to 5.0 mm, both inclusive; an average height H of the convex portions is in the range from 0.1 mm to 0.5 mm, both inclusive; and H.ltoreq.L.ltoreq.2S is met, where S is an average space between the convex portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.