Manufacturing method of semiconductor device
US6100140A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 1996 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Jul 3, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/668
Abstract
A manufacturing method of a vertical type MOSFET, which can suppress vaporization of impurity from a semiconductor substrate and prevent variation in carrier density of the channel, is disclosed. The vertical type MOSFET is formed by forming a local oxide film to form a concavity on the element surface, removing the local oxide film by wet-etching technique, forming the gate oxide film at the sidewall of the concavity by thermal oxidation, and forming a gate electrode. Further, a polycrystalline silicon is formed on a back surface of the semiconductor substrate before removing the local oxide film. Accordingly, since the polycrystalline silicon is not removed when removing the local oxide film, vaporization of impurity from the semiconductor substrate is suppressed during the thermal oxidation for forming the gate oxide film, thereby preventing change in the carrier density of the channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.