Methods of employing aqueous cleaning compositions in manufacturing microelectronic devices
US6100203A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1998 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Jul 16, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02063
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Aqueous cleaning compositions comprise from about 0.01 to about 10 weight percent of hydrogen fluoride; from about 1 to about 10 weight percent of hydrogen peroxide; and from about 0.01 to about 30 weight percent of isopropyl alcohol. Methods of manufacturing microelectronic devices comprise providing electrodes on insulation films on microelectronic substrates; etching the insulation films using the electrodes as etching masks to form an exposed surfaces on the electrodes; cleaning the exposed surfaces with aqueous cleaning compositions comprising from about 0.01 to about 10 weight percent of hydrogen fluoride; from about 1 to about 10 weight percent of hydrogen peroxide; and from about 0.01 to about 30 weight percent of isopropyl alcohol; and forming dielectric films on the exposed surfaces of the electrodes. The cleaning step and the etching step are carried out simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.