Reverse linear polisher with loadable housing
US6103628A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 1, 1998 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | Dec 1, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B47/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is directed to a method and apparatus for polishing a surface of a semiconductor wafer using a pad moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad as the pad moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having a novel wafer loading and unloading method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.