Nutool, Inc.
47Patents
0Active
47Granted
38Portfolio score
Filing activity: Dec 1, 1998 → Oct 28, 2002
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6176992A | Method and apparatus for electro-chemical mechanical deposition | Electricity | 328 | Expired |
| US6328872A | Method and apparatus for plating and polishing a semiconductor substrate | Electricity | 132 | Expired |
| US6413388B1 | Pad designs and structures for a versatile materials processing apparatus | Chemistry; Metallurgy | 108 | Expired |
| US6355153B1 | Chip interconnect and packaging deposition methods and structures | Electricity | 104 | Expired |
| US6409904B1 | Method and apparatus for depositing and controlling the texture of a thin film | Electricity | 103 | Expired |
| US6497800B1 | Device providing electrical contact to the surface of a semiconductor workpiece during metal plating | Electricity | 86 | Expired |
| US6482307B2 | Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing | Electricity | 78 | Expired |
| US6251235A | Apparatus for forming an electrical contact with a semiconductor substrate | Electricity | 76 | Expired |
| US6471847B2 | Method for forming an electrical contact with a semiconductor substrate | Electricity | 69 | Expired |
| US6534116B2 | Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence | Electricity | 67 | Expired |
| US6867136B2 | Method for electrochemically processing a workpiece | Electricity | 66 | Expired |
| US6103628A | Reverse linear polisher with loadable housing | Performing Operations; Transporting | 64 | Expired |
| US6630059B1 | Workpeice proximity plating apparatus | Electricity | 63 | Expired |
| US6402925B2 | Method and apparatus for electrochemical mechanical deposition | Electricity | 61 | Expired |
| US6352623B1 | Vertically configured chamber used for multiple processes | Emerging Cross-Sectional Technologies | 56 | Expired |
| US6666959B2 | Semiconductor workpiece proximity plating methods and apparatus | Electricity | 41 | Expired |
| US6780772B2 | Method and system to provide electroplanarization of a workpiece with a conducting material layer | Electricity | 40 | Expired |
| US6413403B1 | Method and apparatus employing pad designs and structures with improved fluid distribution | Chemistry; Metallurgy | 39 | Expired |
| US6612915B1 | Work piece carrier head for plating and polishing | Chemistry; Metallurgy | 36 | Expired |
| US6354916B1 | Modified plating solution for plating and planarization and process utilizing same | Electricity | 34 | Expired |
| US6908374B2 | Chemical mechanical polishing endpoint detection | Performing Operations; Transporting | 31 | Expired |
| US6610190B2 | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate | Electricity | 30 | Expired |
| US6207572A | Reverse linear chemical mechanical polisher with loadable housing | Performing Operations; Transporting | 27 | Expired |
| US6833063B2 | Electrochemical edge and bevel cleaning process and system | Electricity | 25 | Expired |
| US6478936B1 | Anode assembly for plating and planarizing a conductive layer | Chemistry; Metallurgy | 23 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.