Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
US6103992A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 8, 1996 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | Nov 8, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a through-via in a laminated substrate by laser drilling the through-via in a laminated substrate from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are trepanned in a first predetermined pattern. Each pulse trepanned in the first predetermined pattern has a first energy density per pulse. Then, the through-via is laser drilled using a plurality of laser pulses that are trepanned in a second predetermined pattern. Each pulse trepanned in the second predetermined pattern has a second energy density per pulse that is greater than the first energy density per pulse. The second predetermined pattern is within the first predetermined pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.