Heat treating apparatus
US6104002A · kind A · utility
350Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1998 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | Jul 15, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/135
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A substrate heat treating apparatus with a substrate support plate having a plurality of holes, a heating element to heat the substrate through the support plate, and substrate support pins extending through the plurality of holes in the support plate. Each support pin is mounted so that it is slidable in a horizontal direction within each of the plurality of holes in the support plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.