Gas intake assembly for a wafer processing system
US6105592A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1997 |
| Grant date | Aug 22, 2000 |
| Priority date | — |
| Expiry date | Jul 21, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing a semiconductor wafer is set forth. The apparatus comprises a processing bowl that defines a processing chamber. The bowl has an opening through which wafers may be placed in the apparatus. A wafer support structure adapted to support at least one wafer is mounted for rotation within the processing chamber. A motor drive assembly is connected to rotate the wafer support structure. At least one fluid nozzle accepts processing fluid and sprays the processing fluid on the one or more wafers carried by the wafer support structure. A door is used to seal the opening of the processing bowl. The door has an opening that is open to ambient atmosphere to facilitate passage of ambient gas into the processing chamber. An ambient gas intake assembly is disposed in the door. The ambient gas intake assembly comprises a high efficiency filter, preferably, and ULPA filter, disposed to filter ambient gas passing from the opening of the door to the processing chamber and a heater disposed to heat the filtered gas prior to entering the processing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.