Via fill compositions for direct attach of devices and method for applying same
US6106891A · kind A · utility
22Cited by
13References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1998 |
| Grant date | Aug 22, 2000 |
| Priority date | — |
| Expiry date | Dec 18, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.