Chemically amplified positive resist composition
US6106993A · kind A · utility
26Cited by
5References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1998 |
| Grant date | Aug 22, 2000 |
| Priority date | — |
| Expiry date | Jul 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/106
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A chemically amplified positive resist composition contains (A) an organic solvent, (B) a base resin, (C) a photoacid generator, and optionally, (D) a dissolution rate regulator. The base resin (B) is a hydroxystyrene copolymer having different acid labile groups and Mw of 3,000-300,000. The resist composition is highly sensitive to actinic radiation such as deep-UV, electron beam and X-ray, can be developed with aqueous base to form a pattern, and is thus suitable for use in a fine patterning technique.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.