Low application temperature hot melt adhesive comprising ethylene .alpha.-olefin

US6107430A · kind A · utility

Assignees

• THE DOW CHEMICAL COMPANY · US
• H.B. Fuller Licensing & Financing, Inc · US

Inventors

• Robert A. Dubois · Marion, US
• Cynthia L. Rickey · Lake Jackson, US
• Steven W. Albrecht · Forest Lake, US
• Beth M. Eichler · Saint Paul, US
• Thomas F. Kauffman · Phillipsburg, US
• Maynard R. Lawrence · Oakdale, US
• Thomas H. Quinn · Windom, US

Key dates

• Filing date: Jan 8, 1998
• Grant date: Aug 22, 2000
• Expiry date: Jan 8, 2018

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L2666/02
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Disclosed are hot melt adhesives comprising at least one first homogeneous linear etylene polymer having a particular density and melt viscosity at 350.degree.F. (177.degree.C.), and an optional wax and tackifier. In particular, disclosed is a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least ibe C.sub.2 --C.sub.20 .alpha.-olefin interpolymer having a density from 0.850 g/cm.sup.3 to 0.895 g/cm.sup.3 ; and b) optionally at least one tackifying resin; and c) optionally at least one wax wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/cm.second) at 150.degree.C. Preferred hot melt adhesives for use in adhering cardboard or paperboard are disclosed, as well as the resultant adhered products. Also disclosed is a dual reactor process for the preparation of the inventive hot melt adhesives.