Beth M. Eichler
2Patents
2h-index
6Co-inventors
30Inventor score
Filing activity: Jan 8, 1998 → Feb 2, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6319979A | Package comprising low application temperature hot melt adhesive comprising ethylene .alpha.-olefin | Emerging Cross-Sectional Technologies | 71 | Expired |
| US6107430A | Low application temperature hot melt adhesive comprising ethylene .alpha.-olefin | Chemistry; Metallurgy | 68 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.