Thermal conditioning apparatus
US6107609A · kind A · utility
7Cited by
27References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1999 |
| Grant date | Aug 22, 2000 |
| Priority date | — |
| Expiry date | Feb 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A support including a plate having a top surface and a receiving hole, a lift element having a contacting end disposed through the receiving hole, a sensor disposed in a bore in the contacting end of the lift element, and a support member adjacent the top surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.