Chemical-mechanical polishing apparatus and method
US6110012A · kind A · utility
18Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 24, 1998 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Dec 24, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for limiting or eliminating the edge effect in a chemical mechanical polishing apparatus comprising a substrate holder and a retaining ring spaced from and around the holder, a rotatable platen and a polishing pad on the platen, by essentially flattening the pad in the area in which it normally tends to deform. The invention is carried out by applying a fluid under pressure, preferably the polishing slurry, to the pad in the region of the gap between the retaining ring and the holder to substantially flatten the pad in the area around the edge of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.