Thin film forming apparatus using laser
US6110291A · kind A · utility
Assignee
Inventors
- Kenyu Haruta
- Koichi Ono
- Hitoshi Wakata
- Mutsumi Tsuda
- Yoshio Saito
- Keisuke Nanba
- Kazuyoshi Kojima
- Tetsuya Takami
- Akihiro Suzuki
- Tomohiro Sasagawa
- Kenichi Kuroda
- Toshiyuki Oishi
- Yukihiko Wada
- Akihiko Furukawa
- Yasuji Matsui
- Akimasa Yuki
- Takaaki Kawahara
- Hideki Yabe
- Taisuke Furukawa
- Kouji Kise
- Noboru Mikami
- Tsuyoshi Horikawa
- Tetsuo Makita
- Kazuo Kuramoto
- Naohiko Fujino
- Hiroshi Kuroki
- Tetsuo Ogama
- Junji Tanimura
Key dates
| Filing date | Aug 7, 1996 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Aug 7, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/732
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thin film forming apparatus using laser includes a chamber (1), a target (5) placed therein, a laser light source (10) for emitting laser beam to target (5), and a substrate holder (3). When target (5) is irradiated with laser beam (16), a plume (15) is generated, and materials included in plume (15) are deposited on the surface of a substrate (2) held by substrate holder (3). The laser beam emitted from laser light source (10) has its cross section shaped to a desired shape when passed through a shielding plate (4804), for example, so that the surface of the target (5) is irradiated with the beam having uniform light intensity distribution. Therefore, a plume (15) having uniform density distribution of active particles is generated, and therefore a thin film of high quality can be formed over a wide area with uniform film quality, without damaging the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.