Patent · US Expired

High pressure magnetron cathode assembly and sputtering apparatus utilizing same

US6110336A · kind A · utility

1Cited by

8References

11Claims

0Family size

Assignee

Forschungszentrum Jülich GmbH · DE

Inventors

Roger Wordenweber · Niederzier, DE
Georg J. Ockenfuss · Santa Rosa, US
Jens Schneider · Bielefeld, DE
Wilfried Klein · Overath, DE

Key dates

Filing date	Aug 10, 1998
Grant date	Aug 29, 2000
Priority date	—
Expiry date	Aug 10, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3405
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A magnetron cathode and sputtering system in which the cathode assembly includes a diaphragm arrangement with one or more diaphragms which overlie at least the edge of the cathode at the dark side region of the gas discharge so that plasmas cannot form between the diaphragm and target. An improved sputtering is thereby obtained in a high pressure mode of operation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.