Multiple polarity mask exposure method

US6110624A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Michael S. Hibbs · Colchester, US
• Timothy E. Neary · South Burlington, US
• David S. O'Grady · Jericho, US
• Denis Rigaill · South Burlington, US

Key dates

• Filing date: Jan 4, 1999
• Grant date: Aug 29, 2000
• Expiry date: Jan 4, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/0577
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A patterned mask and method of forming a patterned mask over a substrate, comprising forming a first resist layer over the substrate, forming a second resist layer over the first resist layer, patterning the first resist using energy selective to the first resist layer to form a first patterned resist, and patterning the second resist using energy selective to the second resist layer to form a second patterned resist, wherein the first patterned resist and the second patterned resist form the patterned mask.