Via pad geometry supporting uniform transmission line structures
US6111205A · kind A · utility
20Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1997 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Oct 28, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connector for coupling high frequency signals between devices includes a substrate having an array of vias for coupling a reference voltage to reference voltage traces that extend along the substrate surface between the devices. Signal traces including device pads for coupling signals to and from the devices alternate with the reference voltage traces. The widths of the reference voltage traces are varied to maintain a substantially constant separation between the reference voltage trace and an adjacent signal trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.