System, circuit, and method for testing an interconnect in a multi-chip substrate
US6111414A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 1998 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Jul 31, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/70
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for testing interconnects in multi-chip modules including a radio frequency resonator having a resonant circuit with a relatively high quality factor, the output of the resonant circuit being attached to a probe. Electrically coupled to the resonant circuit output is an apparatus to analyze the voltage signal output. The probe is applied to one end of an interconnect. When the probe is applied, the resonant frequency of the resonant circuit and the magnitude of the frequency response are altered due to the additional loading created by the interconnect. Due to the relatively high quality factor of the resonant circuit, the magnitude of the frequency response of the altered resonant circuit is measurably distinct from a predetermined reference magnitude at a predetermined reference frequency, thus indicating the existence of a defect. Additionally, the type of defect that exists is ascertainable by determining whether the resonant frequency of the altered resonant circuit is greater or less than the reference frequency by examining, for example, the phase response.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.