Polishing apparatus with improved alignment of polishing plates
US6113478A · kind A · utility
15Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1998 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | Jun 18, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B45/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a polishing machine for simultaneous double-sided polishing of workpieces between upper and lower polish tables, the upper polish table has a hollow center telescopically receiving in a drive hub supported from below. The upper polish plate is suspended by a lifting rod from a double-ended main lifting cylinder having upper and lower ends secured to a frame extending from the lower polish table.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.