Power supply apparatus for sputtering and a sputtering apparatus using the power supply apparatus
US6113760A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1999 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | Jul 28, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/34
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a sputtering power supply apparatus which realizes stable sputtering at a pressure lower than the discharge start pressure, so that scattering of sputtering particles due to collision with sputtering inert gas can be reduced, thereby improving the step coverage and the denseness of the sputter film. According to the present invention, there is provided a sputtering power supply apparatus comprising a sputtering DC power source (A), a constant current circuit (B) connected to the DC power source, a sputtering source (21) connected to the constant current circuit (B), and a control unit (11) for controlling a current output from the constant current circuit (B) so as to be a constant current.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.