Films for use in microelectronic devices and methods of producing same
US6114032A · kind A · utility
19Cited by
5References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 10, 1998 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | Apr 10, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides thin films for use in microelectronic devices. In one aspect, the present invention provides a copper diffusion barrier. In another aspect, the present invention provides a polymer film for various applications including use as a dielectric insulator and surface modification layers. Methods for the production of the films are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.