Process to reduce localized polish stop erosion
US6114248A · kind A · utility
3Cited by
19References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 1998 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | Jan 15, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for reducing polish stop erosion includes using a slurry of particles and an alkaline solution. The slurry for reducing polish stop erosion has a reduced solids content, finer particle size, and an increased chemical component. The pH of the slurry is between about 9.5 and 10.5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.