Thermally conducting materials and applications for microelectronic packaging
US6114413A · kind A · utility
76Cited by
1References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1998 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | Jul 7, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conductive paste structure is is disclosed which is a combination of a polymeric material and particles, e.g. Cu, having a thermally conductive coating, e.g. Sn. Heat is applied to fuse the coating of adjacent particles. The polymeric material is a thermoplastic. The conductive paste structure is disposed between two thermally conductive surfaces, e.g.chip and substrate pads, to provide thermal interconnection and adhesion between their pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.