Thermally-enhanced flip chip IC package with extruded heatspreader
US6114761A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 1998 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | Jan 20, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally-enhanced flip chip integrated circuit (IC) package has a package substrate to which an IC die is bonded. A thermally-conductive heatspreader, having planar dimensions larger than the IC die, is thermally bonded at or near its center to an upper surface of the IC die. A plurality of cooling extensions are formed that protrude from a lower surface (the surface closest to the package substrate) of the heatspreader so as to create passageways through which cooling air may flow. In one embodiment, the cooling extensions are parallel fins that protrude transversely from the lower surface of the heatspreader, thereby forming U-shaped channels. In another embodiment, the cooling extensions are an array of fin pins that protrude transversely from the lower surface of the heatspreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.