Patent · US Expired

Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same

US6116495A · kind A · utility

1Cited by

13References

6Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Dietrich Richter · Berlin, DE
Peter Straub · Zug, CH
Marian Lancki · Berlin, DE
Peter Diehm · Rotkreuz, CH
Dieter Berchtold · Stade, DE
Hans-Georg Wissmeier · Hersbruck, DE

Key dates

Filing date	Mar 18, 1999
Grant date	Sep 12, 2000
Priority date	—
Expiry date	Mar 18, 2019

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S428/901
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8) The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.