Substrate retaining ring
US6116992A · kind A · utility
48Cited by
5References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 30, 1997 |
| Grant date | Sep 12, 2000 |
| Priority date | — |
| Expiry date | Dec 30, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A retaining ring is configured for use with an apparatus for polishing a substrate. The substrate has upper and lower faces and a perimeter. The apparatus has a movable polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retaining ring has a retaining face for engaging and retaining the substrate against lateral movement and a bottom face for contacting the polishing surface of the polishing pad. The bottom face of the retaining ring extends downward from an inner portion adjacent the retaining face to a lowermost portion radially outboard of the retaining face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.