Pastes for improved substrate dimensional control
US6117367A · kind A · utility
8Cited by
17References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 1998 |
| Grant date | Sep 12, 2000 |
| Priority date | — |
| Expiry date | Feb 9, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/092
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Metal pastes used in the fabrication of multilayer ceramic (MLC) substrates used in semiconductor devices. The pastes reduce substrate defects, such as via bulge and camber. The pastes are comprised of a metal having high conductivity, frit which includes glass, an organic binder, and a solvent, optionally with a surfactant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.