Robert A. Rita
32Patents
12h-index
73Co-inventors
84Inventor score
Filing activity: Jun 21, 1983 → Mar 12, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6072690A | High k dielectric capacitor with low k sheathed signal vias | Emerging Cross-Sectional Technologies | 82 | Expired |
| US6178082A | High temperature, conductive thin film diffusion barrier for ceramic/metal systems | Electricity | 66 | Expired |
| US5283104A | Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates | Emerging Cross-Sectional Technologies | 53 | Expired |
| US6023407A | Structure for a thin film multilayer capacitor | Emerging Cross-Sectional Technologies | 44 | Expired |
| US5337475A | Process for producing ceramic circuit structures having conductive vias | Emerging Cross-Sectional Technologies | 25 | Expired |
| US6339527B1 | Thin film capacitor on ceramic | Electricity | 25 | Expired |
| US6430030B2 | High k dielectric material with low k dielectric sheathed signal vias | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6200400A | Method for making high k dielectric material with low k dielectric sheathed signal vias | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6791133B2 | Interposer capacitor built on silicon wafer and joined to a ceramic substrate | Electricity | 19 | Expired |
| US6943108B2 | Interposer capacitor built on silicon wafer and joined to a ceramic substrate | Electricity | 17 | Expired |
| US6216324A | Method for a thin film multilayer capacitor | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6285080A | Planar metallized substrate with embedded camber control material and method thereof | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6461493B1 | Decoupling capacitor method and structure using metal based carrier | Electricity | 10 | Expired |
| US6713686B2 | Apparatus and method for repairing electronic packages | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6117367A | Pastes for improved substrate dimensional control | Electricity | 8 | Expired |
| US5489465A | Edge seal technology for low dielectric/porous substrate processing | Emerging Cross-Sectional Technologies | 5 | Expired |
| US5655209A | Multilayer ceramic substrates having internal capacitor, and process for producing same | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7186461B2 | Glass-ceramic materials and electronic packages including same | Electricity | 4 | Expired |
| US5948193A | Process for fabricating a multilayer ceramic substrate from thin greensheet | Electricity | 4 | Expired |
| US6436332B1 | Low loss glass ceramic composition with modifiable dielectric constant | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6171988A | Low loss glass ceramic composition with modifiable dielectric constant | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6413339B1 | Low temperature sintering of ferrite materials | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6210545A | Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target | Chemistry; Metallurgy | 3 | Expired |
| US6475555B2 | Process for screening features on an electronic substrate with a low viscosity paste | Electricity | 3 | Expired |
| US6231707A | Method of forming a multilayer ceramic substrate with max-punched vias | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.