Method and device for repairing defective soldered joints
US6119919A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 9, 1999 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Dec 9, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/11334
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Method for repairing defective soldered joints, in which in a first method step a soldering material handling device is placed with a soldering material removal device at a soldering material defect point and a defective soldering material deposit is loosened from the connection with a soldering material carrier and removed, and in which in a second method step a soldering material unit from a soldering material application device of the soldering material handling device is applied to the soldering material carrier and connected to the soldering material carrier, the application device being placed at the soldering material defect point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.