Method for the manufacture of printed circuit boards
US6120639A · kind A · utility
12Cited by
15References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1997 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Nov 17, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1157
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for improving the adhesion of a copper surface to a resinous layer, the process comprising contacting the copper layer with an adhesion promoting composition comprising a reducing agent and a metal selected from the group consisting of gold, silver, palladium, ruthenium, rhodium, zinc, nickel, cobalt, iron and alloys of the foregoing metals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.