Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate
US6122174A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1999 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Jun 2, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus is disclosed. In one embodiment, the apparatus includes a semiconductor substrate and a second substrate. The semiconductor substrate has a top side and a bottom side. The semiconductor substrate has an integrated circuit and at least one alignment fiducial formed on the top side. The alignment fudicial is aligned with the integrated circuit and the alignment fiducial is accessible from the bottom side. The semiconductor substrate further includes a first set of bond pads on the integrated circuit, the bond pads on the top side. The second substrate has a second set of bond pads corresponding to the first set of bond pads. The semiconductor substrate is coupled to the second substrate at a plurality of solder interconnections disposed between the first and the second set of bond pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.