Method and apparatus for selectively marking a semiconductor wafer
US6122562A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 1997 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | May 5, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus that accurately marks a wafer at selected locations such as a defect location on the surface of a wafer such that a wafer analysis system (e.g., SEM or AFM) may rapidly find the defect. The apparatus contains a wafer platen for retaining a wafer in a substantially horizontal orientation and a marking assembly mounted above the wafer platen. The marking assembly further contains an optical microscope and a marking head. In operation, a user locates a defect using the optical microscope and places a pattern of fiducial marks at a predetermined distance from the defect, e.g., four marks in a diamond pattern circumscribing the defect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.