Method and apparatus for improved conditioning of polishing pads
US6123607A · kind A · utility
35Cited by
5References
25Claims
0Family size
Inventors
Key dates
| Filing date | May 17, 1999 |
| Grant date | Sep 26, 2000 |
| Priority date | — |
| Expiry date | May 17, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for conditioning the surface of a polishing pad used to polish a substrate, such as a semiconductor wafer. A conditioning apparatus uses two or more end effectors to abrade and/or remove the polishing byproducts from the surface of the pad. Different types of conditioning performance can be achieved when the end effectors are employed individually, sequentially, or simultaneously during a polishing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.