Method and apparatus for forming low dielectric constant polymeric films
US6123993A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 1998 |
| Grant date | Sep 26, 2000 |
| Priority date | — |
| Expiry date | Sep 21, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4481
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for forming a low dielectric constant polymeric film on a substrate, by liquid delivery of a parylene precursor reagent, in the form of an organic solution or a neat liquid, subsequent flash vaporization of the neat liquid or organic solution, pyrolytic "cracking" of the precursor to form the reactive monomer and/or reactive radical species, and condensation and polymerization of the monomer and/or reactive radical species to form a low dielectric constant polymeric film on the substrate. The low dielectric constant polymeric film may comprise a parylene film, formed from a precursor such as [2.2]paracyclophane, an alkyl- and/or halo-substituted derivative thereof, or an analogous compound of a p-xylene derivative.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.