Method of manufacture of multilayer circuit boards
US6123995A · kind A · utility
6Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 1998 |
| Grant date | Sep 26, 2000 |
| Priority date | — |
| Expiry date | Mar 6, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/424
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of providing an electrically conductive polymer coating on a copper clad circuit board prior to electroplating is disclosed. The method teaches the application of certain organic solvents to a conductive polymer composition already applied to the board but before drying the conductive polymer composition to remove liquids therefrom to form a conductive polymer film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.