Patent · US Expired

Method and device for precise alignment of semiconductor chips on a substrate

US6127254A · kind A · utility

17Cited by

3References

9Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Ulrich Diebold · Herrenberg, DE
Otto A. Torreiter · Echterdingen, DE
Hans Wiedemann · Sauerlach, DE

Key dates

Filing date	Nov 10, 1998
Grant date	Oct 3, 2000
Priority date	—
Expiry date	Nov 10, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/014
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and device are presented for precise alignment of a semiconductor chip on a substrate which, in a simple and cost-effective way, permit accurate alignment of individual chips on a substrate to be ensured.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.